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以下为 TC Wafer 晶圆测温方案在不同工艺场景下的关键规格对比，供选型参考。
| 规格项 / Spec | Front-end/Back-end（前道/后道） 高温 K/PLⅡ · 0–1100°C |
Front-end（前道） R/S · 0–800°C |
Front-end/Back-end（前道/后道） 低温 K · −100–300°C |
Front-end（前道） 低温 K · −100–300°C |
|---|---|---|---|---|
| Temp Range 温度范围 | 0°C – 1100°C | 0°C – 800°C | −100°C – 300°C | −100°C – 300°C ① |
| Tolerance 允差 | ±1.1°C or ±0.4% of reading, whichever is greater | ±1.5°C or ±0.25% of reading, whichever is greater | ±1.1°C or ±0.4% of reading, whichever is greater | ±1.1°C or ±0.4% of reading, whichever is greater |
| Accuracy 精度 | <±0.1°C in cold wall chamber <±0.3°C ± 2.0°C |
<±0.1°C in cold wall chamber <±0.1°C ± 2.0°C |
<±0.1°C in hot wall chamber | <±0.1°C in hot wall chamber |
| Wafer Size 晶圆尺寸 | 2 – 12 inch | 4 – 12 inch | 2 – 12 inch | 2 – 12 inch |
| Number of TC 热电偶点数 | 1 – 24 | 1 – 24 | 1 – 24 | 1 – 24 |
| TC Type 热电偶类型 | K、PLⅡ | R / S | K | K |
| Sensor Lead 传感器引线 | Quartz / Silica Sleeving | Sheath | Polyimide Flat Cable | Polyimide Flat Cable |
| Connector Type 接头类型 | • D-subminiature (up to 37) • 2-pin miniature connector plugs |
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| Related Processes 适用工艺 | • DPE/S（干法等离子刻蚀/选择性） • EPI |
• LPCVD/SACVD Cold Wall • MCVD/MOCVD • Ovens • PECVD • PVD • RTP • SOD |
• Hot Wall • LPCVD/SACVD Hot Wall • RTP |
• Atmospheric & Belt CVD • Solder Reflow • Photoresist Track Systems • Prober Hot Plates & Chucks |