Overview
Diffusion, oxidation and annealing furnaces demand tight temperature control with very low contamination risk. The sensor has to be accurate, cleanable and compatible with the process atmosphere.
Key Points
High-purity sheaths. Standard alloys can outgas and contaminate wafers; specify high-purity or precious-metal sheaths in the hot zone.
Stability over absolute accuracy. Repeatability run-to-run matters more than the nominal tolerance class.
Multi-point profiling. Multipoint assemblies verify uniformity across the load without repeated trials.
Clean assembly. Assemble and seal in a controlled environment to avoid introducing particles.
Summary
For semiconductor service, specify the sheath material and surface finish explicitly on the drawing — this is where most field problems originate.
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