TC Wafer (Thermocouple Wafer) and RTD Wafer (Resistance Temperature Detector Wafer) are wafer-level in-situ temperature sensors dedicated to semiconductor manufacturing. The sensing elements are integrated directly onto substrates identical in material and dimensions to production wafers, so the sensors can be placed inside the process chamber to acquire true wafer-surface temperature data. They provide the essential temperature basis for process tuning, equipment qualification and yield improvement, and are widely used in RTP (rapid thermal processing), CVD/PVD deposition, etching, and photoresist coating and developing processes.
Features
- Temperature range -50 °C to 1200 °C, covering R, S, K, T and PL-II thermocouple types
- Measuring junctions fixed by silicon-wafer clamping (embedded + ceramic filling + wafer bonding) or ceramic adhesive bonding
- Silicon, sapphire and silicon carbide substrates, fully matched to production wafers
- Passive temperature sensing based on the Seebeck effect, with no internal power supply required
- Custom 2–12 inch wafers; the number of measuring points is configurable, with full-wafer temperature-field mapping
- Compatible with a wide range of connection interfaces and lead insulation materials
